Switching n-p-n mesaepitaxial planar silicon transistors for switching and impulse devices.
2T935-A transistor is produced in a metal-ceramic case with hard terminals.
2T935A-5 is a set of undivided dies with contact plates for hybrid integrated microcircuits.
Device type is indicated on the label.
Mass:
in metal-ceramic case not more than 20g
die not more than 0.01 g
Electrical parameters
Static forward current transfer ratio at Tc=+25 oC, Uce=4 V, Ic=15 A at Tc=+125 oC, Uce=54 V, Ic=3 A at Tc=-60oC, Uce=4 V, Ic=15 A | 20..30..100 150 10..100 |
Beta cutoff at Uce=10 V, Ic=1 A, not less than | 51 MHz |
Critical voltage at Ic=1 A, not less than | 70 V |
Collector-to-emitter saturation voltage at Ic= 15 A, Ib=3 A bogey value | 1 V 0.75* V |
Base-to-emitter saturation voltage at Ic= 15 A, Ib=3 A bogey value | 1.7 V 1.3 V |
Turn-on time at Ic= 10 A, Ib=2 A, not more than | 0.25 µs |
Turn-off time at Ic= 10 A, Ib=2 A, not more than | 0.7µs |
Collector junction capacitance at Ucb=10 V, not more than | 800 pF |
Emitter junction capacitance at Ueb=4 V, not more than | 3500 pF |
Collector-to-emitter cutoff current at Rbe=10 ?, not more than at Td=min..+25 oC, Uce=80 V at Td=max, Uce=60 V | 30 mA 60 mA |
Emitter cutoff current at Ueb=4 V, not more than | 300 mA |
Operational limits
Collector-to-emitter constant voltage at Rbe=10 ? and Tj=+100 oC | 80 V |
Collector-to-emitter impulse voltage at Rbe=10 ?, impulse time 50 µs, wavefront time 15 µs, pulse ratio 20 | 100 V |
Emitter-to-base constant voltage | 5 V |
Emitter-to-base impulse voltage at impulse time 50µs, pulse ration 20 | 6 V |
Collector constant current | 20 A |
Collector impulse current at impulse time 1 µs, pulse ratio 2 | 30 A |
Base constant current | 10 A |
Base impulse current at impulse time 1 µs, pulse ratio 2 | 15 A |
Collector power dissipation at Tc=min..+50 oC | 60 W |
P-n junction temperature | +150 oC |
Ambient air temperature | -60..+125 oC |
2T935A-5 die mounting should provide junction-to-case thermal resistance not less than 1.6 oC/W
Dies should be separated and connected to contact plates in accordance with pre-approved typical process.